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In surface micromachining, thin lms are deposited on a thick substrate wafer and etched using photolithographic masks to de ne patterns in the deposited layers By alternating deposition and etching, several layers of different materials can be stacked to create intricate microstructures Since lithography requires at surfaces and the thickness of an individual layer is limited to a few microns compared to the size of the wafers (usually 2, 3, 4, 6, 8, and 12 inches in diameter), MEMS devices are generally very at structures In this sandwich construction, some sacri cial layers are included so that they can be dissolved at the end to create releasable (ie, movable) mechanical structures Figure 151 illustrates the surface micromachining process with a single sacri cial layer and a single movable structural layer Multilayered structures with alternating structural and sacri cial layers can be obtained in a similar manner.

MUMPs, Multi-User MEMS Processes, which were successfully made available as a foundry process for MEMS by the Microelectronic Center of North Carolina, is an example of a multilayered surface micromachining process SUMMiT, Sandia Ultra-planar Multi-level MEMS Technology,* process is another example While MUMPs consisted of three structural layers, SUMMiT consists of four or ve with added steps of planarization in between Many of the devices described in Sec 5 of this chapter are made using the SUMMiT process In contrast to surface micromachining, in bulk micromachining a bulk wafer whose thickness is of the order of a few hundred microns is sculpted using etching techniques to de ne the structures Bulk micromachining also uses deposition and etching of thin lms, but the primary feature creation is due to the substantial etching of the substrate wafer When etched through large depths, the distinction between isotropic and anisotropic etches becomes important.

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Another program that is included in this book s CD ROM is National Semiconductor s Code Loader It also assists the engineer in designing phase-locked loops Code Loader, after we select the desired National PLL chip along with other basic parameters permits the design and Bode plot viewing of the loop filter s response, and allows the programming (through a computer) of the physical PLL s N and R counters, phase detector, charge pump, and other registers A low-cost program, AADE s Filter Design, helps the engineer simply and rapidly design almost all types of lumped low-pass, high-pass, bandpass, and bandstop filters, such as Butterworth, Chebyshev, Elliptic, Bessel, gaussian, and crystal ladder, while also displaying the filter s insertion loss, return loss, group delay, input impedance, etc.

Some chemicals etch certain materials equally in all directions and are called isotropic etchants for those materials, while others have different etch rates in different directions and create anisotropically etched surfaces Both isotropic and anisotropic etches are effectively used in MEMS devices depending on the desired geometry Since the substrate wafer is etched to a large depth, bulk micromachined MEMS devices tend to be much (about 10 times) thicker than the surface micromachined structures A sample bulk micromachining technique is illustrated in Fig 152 One disadvantage with traditional bulk etching of silicon in building very thick microstructures (up to a few hundred microns) is the lack of vertical sidewalls of etched surfaces While isotropic etches lead to curved sidewalls, some anisotropic etches lead to slanted surfaces, and both are undesirable in many applications.

One good use for the goto is to exit from a deeply nested routine. For example, consider the following code fragment:

As this program is circuit theory based, and also uses ideal components (except for inductor Q), internal stray coupling and distributed reactances will begin to undermine its design accuracy as the frequency increases This can be somewhat mitigated by designing for a higher frequency than that desired, since the stray effects will naturally lower the filter s center frequency Regardless of its limitations, this program is a musthave software tool for lumped filter design LC Match, by RadioCom Corporation, is a free program available on the Web that lets the designer enter a circuit s source and load impedance, and then.

The shape of the lithographic mask and the shape of the etched pit as viewed from the top of the wafer are also.

query. This is particularly true for complex queries or queries that you know may be better run scheduled rather than in real time. To do so, click Edit Report to go to the formatted report view and then select Save.

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